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In reality, the data transfer rate does not determine whether a given board operates at low or high speed. When most engineers think of high speed design, they want to set a threshold in terms of the data rate in the device. The right layer stack and grounding strategy will help a device pass EMC checks, suppress EMI, and ensure signal integrity in these mixed signal devices. These aspects of high speed design affect EMC and grounding requirements, and designers should carefully design their layer stack. With many high speed devices that incorporate wireless functionality or interface with external analog systems, grounding and layer stack design are also important.
Cst microwave studio rise time setting serial#
These high speed design techniques are geared towards ensuring that signals remain free of artefacts that can lead to high bit error rates, clock streams and serial or parallel data remain synchronized throughout a board, and transmission line effects are suppressed in long PCB traces. With devices that run at even modest data rates switching at speeds on the order of nanoseconds or less, every designer should take signal integrity design considerations seriously during high speed design. These high speed devices exhibit peculiar signal integrity problems when they are not laid out properly. Ever since the introduction of TTL and faster logic families, designers have found that simple PCB layout arrangements were not adequate to maintain signal integrity. There is a saying in the PCB design community: there are those who already worry about high speed design, and those who will soon need to worry about high speed design.